Overview：MA/BA6 is a relatively-new-generation, semi-automatic lithography and bonding alignment equipment manufactured by SUSS. It is equipped with a high-reliability, high-precision alignment system. It also has the ability to transfer sub-micron high-resolution patterns. It is a common and important lithography equipment.

Applications：Patterning of microstructures for laboratory R&D and small batch processing.

Features：

• Exposure mode: Proximity, soft contact, hard contact, vacuum contact

• Wavelength range: 350-450nm

• Line resolution： 0.8um

• Alignment method：Frontal alignment, rear alignment

• Alignment accuracy：0.5um (front), 1um (back)

• Substrate size：under 6 inches and fragments