Overview：Wire bonder uses ultrasonic energy to tightly weld metal wires to substrate pad, so as to realize good electrical interconnection between chip and PCB.

Applications：Device pacakaging, Transport measurement, etc.

Features：

• Metal Wires: Al and Au wires

• Bond force : 18-90 grams

• Range of movement of the tool by manipulator control ： 0.563-in. vertically and 0.625-in. horizontally