Wire bonders

2021/1/25 14:25:36


Overview:Wire bonder uses ultrasonic energy to tightly weld metal wires to substrate pad, so as to realize good electrical interconnection between chip and PCB.

Applications:Device pacakaging, Transport measurement, etc.


  • Metal Wires: Al and Au wires

  • Bond force : 18-90 grams

  • Range of movement of the tool by manipulator control : 0.563-in. vertically and 0.625-in. horizontally