Overview：This machine is used for inter-chip bonding via Indium or Solder bumps using one of several available flip-chip techniques such as solder reflow and thermo-compression. It equips formic acid pre-processing unit especially for deoxidise of Indium bumps' surface.

Applications：Device packaging for multi-layered chips.

Features：

Post-bond accuracy: 3μm

Force range: 0.2-200N

Temperature range: room temperature – 400℃

Chip size range: 0.25 to 22mm

Substrate size range: 2 to 50mm

System compatible with formic acid