Overview：The DS series dicing machine provides accurate slicing process. Wafers can be sliced into small pieces with specified sizes and shapes under a high-speed rotating blade after one-time or sequential slicing.

Applications： Rapid and accurate wafer slicing (Si, GaAs, sapphire, glass, etc)

Features：

• Rotation Speed：10000~50000rpm，

• Minimum Moving Distance：1.0μm@X, 0.5μm@Y, 1.0μm@Z,

• Cutting Speed：0.1~400mm/sec

• Maximum Wafer Size：Φ6 inch

• Maximum Cutting Depth：4mm，

• Repeatability Positioning Accuracy：5μm@Y, 1μm@Z