Overview：Electron beam evaporation deposition system uses electron beam which is accelerated by high voltage under ultra-high vacuum to hit the target in the crucible. The electrical energy is converted into heat that makes the target melt, and the melted material naturally evaporates and deposits on the substrate, forming a thin film. Electron beam evaporation coating is a common method for preparing high-quality thin films.

Applications：Deposition of monolayer or multilayer films of various materials, such as Ti thin films, Al thin films, Ti-Au bilayer films, (Co-Pt) n multilayer films, Al- Al2O3-Al multilayer films.

Features：

• Vacuum: ≤ 3.0E-9mbar; 4 UHV Chamber; 4 Crucibles

• Ion beam cIeaning angle : 0°~360°@Horizontal, -65°~65°@Vertical.

• Deposition angle :  0°~360°@Horizontal; -65°~65°@Vertical.

• E-Beam Power: 10KW; Acceleration Voltage: -4KV~-10KV;

• Oxygen Pressure for Oxidation Chamber : 0.01Pa~133Pa